WLCSP
This package is very small and cheap to produce. It also has benefits due to the lack of bond wires. Bond wires increase parasitic inductance, and can be a problem for high speed designs.
The downside is that they are very tiny!
The last 5 layers of the Skywater PDK define the layers necessary to build the WLCSP package.
Course feedback
It was such a great opportunity to do something on my own and see a piece of silicon where there is my invention or my part doing things. It was in the back of my mind for a long time, I think it was my dream to put something into silicon but it was so expensive until this opportunity arrived.
Pawel Sitarz (digital course)